R.YUVARAJ; K. S. SAKTHI MONISH; R. SANJU ARAVIND; M. SANJAY; B. SANTHOSH. Modification of copper surface for increasing contact angle of water droplet using physical methods . International journal of intellectual advancements and research in engineering computations, [S. l.], v. 7, n. 2, p. 2697–2708, 2019. DOI: 10.61096/ijiarec.v7.iss2.2019.2697-2708. Disponível em: https://ijiarec.com/ijiarec/article/view/1030. Acesso em: 22 jun. 2026.